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EVASA launches new encapsulants to the market

EVASA launches new encapsulants to the market

EVASA launches new encapsulants to the market

EVASA is always working to improve the performance of its encapsulants, thus, has developed new materials in order to fulfill its customers’ needs. The first one, Solarcap® PID FREE, is a new encapsulant with a high electrical resistivity which prevents PID effects. Modules laminated with standard components and PID FREE encapsulant have been tested by different laboratories and protocols, getting losses below 2%. • TUV (-1000V (DC), 168 hours, room temperature, cover with aluminum foil) • ITE (-1000 V (DC), 168 hours, 25 ºC, 85% humidity) • ITE (-1000 V (DC), 48 hours, 85 ºC, 85% humidity) • IES Polytechnic University (-1000 V (DC), 330 hours, room temperature, cover with aluminum foil) The encapsulant Solarcap®  PID FREE  has been approved by the TUV Rheinland. To help our customers to achieve the maximum performance of its modules, EVASA has developed a new encapsulant (Solar Total Transmission) with a lower UV cut-off, which allows to cells increase its performance. EVASA Solarcap® materials, including Solar Total Transmission encapsulants, are totally protected against degradation and yellowing, and of course maintain all the advantages of Solarcap® products: very high gel content (>87%), excellent light transmission and superior adhesion properties (>85 N/cm). As it almost does not shrink at all (less than 1%) there is no need to buy additional material which would result in higher cost for the overall production.